Description
Semi-standard metal wafer ring frame (model MWF-06) for wafer dicing, back grinding, die sort and pick-and-place processes in IC assembly lines.
Features
- Model MWF-06, semi standard – compatible with Disco process flows
- Material: stainless steel (SUS420J2), plastic option available
- Finishing: shiny or matt surface
- Also available in 8 inch and 12 inch sizes
- Silver finish, lapped surface
Application
- IC assembly and in-line wafer handling
- Wafer back grinding and dicing
- Wafer or die sort, pick and place, and die shipping
Specifications
- Brand: Ruiysion | Origin: Shenzhen, China
- Size: 6 inch
- Single package size: 32 x 32 x 4 cm
- Single gross weight: 0.200 kg
- Delivery: contact us for lead time
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