UV Dicing Blue Film – PVC Wafer Cutting Tape 20-40 cm Width, 100 m Rolls

Product application:

1. Used for surface protection when cutting semiconductor silicon wafer (wafer).

2. Prevent surface damage and pollution when electroplating PCB

3. It is used to prevent the stainless steel plate, aluminum plate and nameplate from being damaged during processing. Used to protect glass and aluminum window frames and other materials.

Category:

Description

PVC-based blue dicing tape for semiconductor wafer cutting, LED chip cutting and sorting – an acrylic adhesive system holds wafers flat on the frame during back grinding, thinning and cutting, then releases cleanly.

Features

  • Base material: PVC; adhesive system: acrylic
  • Colour: blue; thickness customizable
  • Width can be cut as needed – 20, 21, 23, 30 and 40 cm x 100 m rolls in stock sizes
  • Acrylic adhesive suitable for demanding process conditions
  • Protects wafer surfaces from damage and pollution during processing

Application

  • Surface protection while cutting semiconductor silicon wafers
  • Protective tape for wafer back grinding, thinning and cutting in semiconductor and packaging fabs
  • Prevents surface damage and pollution during PCB electroplating
  • Protection for stainless steel plates, aluminum plates and nameplates during processing

Specifications

  • Roll sizes: 20 cm x 100 m, 21 cm x 100 m, 23 cm x 100 m, 30 cm x 100 m, 40 cm x 100 m
  • Custom widths and thicknesses on request

UV dicing blue film roll for wafer cutting

PVC blue dicing tape on wafer frame

wafer cutting blue film width options

UV protective blue film detail

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