Wafer Expansion Ring – LED Dicing Expand Ring Frame 5 to 12 Inch, Custom Colors

Description

Wafer expansion rings (sub-parent ring / expanding ring) for LED and semiconductor dicing lines – sizes from 5 to 12 inch, colors customizable to your process requirement.

Features

• Long-term supply models: 5, 6, 7, 8, 10 and 12 inch
• Color customizable according to customer requirements
• Precise inner/outer ring dimensions for stable die expansion
• Rigid construction keeps its shape through repeated expansion cycles

Specifications

• 5 inch: inner ring 123 mm / outer ring 135 mm / thickness 6.0 mm
• 6 inch: inner ring 141 mm / outer ring 152 mm / thickness 6.0 mm
• 7 inch: inner ring 170 mm / outer ring 183 mm / thickness 7.0 mm
• 8 inch: inner ring 198 mm / outer ring 212 mm / thickness 7.0 mm
• 10 inch: inner ring 229 mm / outer ring 248 mm / thickness 7.0 mm
• 12 inch: inner ring 325 mm / outer ring 345 mm / thickness 7.0 mm

Please confirm the required size before placing an order.